Laser Dicing Machine_Galatek

Galatek MRS-SG series is a laser precision processing equipment based on internal focusing technology, which can be used in the cutting of silicon (Si) wafers. It is developed based on the InteVega framework and Vision technology platform, including automatic profile recognition, automatic alignment, automatic reference point setting, automatic focusing and other functions. The whole machine is designed to be started with one click, automatically reads barcodes and adjusts gears. it is equipped with processing equipment, and integrates multiple functions required by wafer production line specifications such as production information statistics, crop operation rate statistics, and data uploading.

Galatek MRS-SL series, based on the characteristics of Sapphire material, through the use of laser internal focus cutting process principle, is a high precision, high efficiency precision processing equipment. It is developed based on the InteVega framework and Vision technology platform, including automatic profile recognition, automatic alignment, automatic reference point setting, automatic focusing and other functions. The whole machine is designed to be started with one click, automatically reads barcodes and adjusts gears. it is equipped with processing equipment, and integrates multiple functions required by wafer production line specifications such as production information statistics, crop operation rate statistics, and data uploading.

Galatek MRS-AG series, developed on based on the characteristics of LOW-K Layer material and the use of laser grooving process principle, is a high precision, high efficiency precision processing equipment. The whole machine is designed to be started with one click, automatically reads barcodes and adjusts gears, automatically cleaning, coating and cutting, and it integrates multiple functions required by wafer production line specifications such as production information statistics, crop operation rate statistics, and data uploading.