Fully Automatic Wafer AOI Equipment_Galatek

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OFFICIALMAIL@GALATEK.AI

Oskar-Schlemmer-Str 23, 80807 Munchen, Germany

Fully Automatic Wafer AOI Equipment
Fully Automatic Wafer AOI Equipment
Fully automated wafer surface inspection is a vital part of the integrated circuit manufacturing industry and is mainly used to detect micro defects on wafer surfaces such as scratches, contamination, particles and other anomalies. With the continuous progress of process technology and the reduction of chip size, the requirements for wafer quality are increasingly strict, and automatic inspection equipment has become the key to ensure production efficiency and product quality.

Product Introduction

Fully Automatic Wafer AOI Equipment MRS-WI260

Fully Automatic Wafer AOI Equipment MRS-WI360

SiC/GaN AOI Equipment

Fully Automatic Wafer AOI Equipment MRS-WI260
Fully Automatic Wafer AOI Equipment MRS-WI260

Galatek fully automatic wafer AOI equipment MRS-WI260, is suitable for surface defect detection of patterned wafer. It has macro and micro defect detection capabilities and can detect systemic defects and random defects. It is a high-performance inspection equipment for product yield management.

Fully Automatic Wafer AOI Equipment MRS-WI360
Fully Automatic Wafer AOI Equipment MRS-WI360

Based on 2D Wafer AOI Equipment MRS-WI260, Galatek fully automatic wafer AOI equipment MRS-WI360, adding 3D structure measurement function, is one of the core inspection equipment for product yield management.

SiC/GaN AOI Equipment
SiC/GaN AOI Equipment

Galatek SiC/ GaN wafer AOI equipment, on the basis of MEGAROBO standard AOI and adding real-time focusing module, using high-resolution camera, machine vision technology and AI algorithm, automatically detect various defects of SiC/ GaN products. It is one of the core equipment for compound process inspection and product yield management.

Product Features

High Production Capacity
High Production Capacity
Productivities ≥ 35WPH (@12-inch wafer, 5x objective, do not calculate the review photographing time).
High Accuracy
High Accuracy
Minimum defect size: 0.5μm; false negative rate: ≤ 0.2%, false positive rate: ≤ 1%, detection repeatability: ≥ 99%.
Software Extension Functions
Software Extension Functions
Support SECS/GEM interface protocol, and support remote operation and maintenance Support input and output of Map formats such as Sinf, Klarf, etc.
AI Technology Application
AI Technology Application
The self-developed AI vision integration solution effectively improves the defect detection ability and reduces the false positive rate. With AI-based ADC function, defect classification accuracy ≥98%.
Wide Detection Range
Wide Detection Range
Detection object: RDL, Bump, Pad, PMI, UBM, Via, Overlay, Chipping, etc.
Detection capabilities: defect positioning, length, width, area, etc. and object length and width/diameter/aperture, offset, missing, etc. Detection capabilities: defect positioning and object length, width, diameter, aperture, offset, etc.
High Compatibility
High Compatibility
Compatible with 8-inch and 12-inch patterned wafers. It can also be customized to be compatible with 4-inch, 6-inch wafers, as well as wafer after dicing and reconstituted wafer.

Product Features

High Production Capacity
High Production Capacity
Productivities ≥ 30WPH (@12-inch wafer, do not calculate the review photographing time).
High Accuracy
High Accuracy
Height measurement accuracy: ≤0.2μm, with low false negative rate, false positive rate, and good detection repeatability.
Software Extension Functions
Software Extension Functions
Support SECS/GEM interface protocol, and support remote operation and maintenance. Support input and output of Map formats such as Sinf, Klarf, etc.
Wide Detection Range
Wide Detection Range
Applicable to SI, compound, ceramic, TSV and other products, the detection object includes Copper pillar, Solder, Gold bumps, Micro bumps, TSV, etc. The measurement items include height, depth, coplanality measurement, etc. The measurement range: BH: 1~3000μm; BD: 10 to 3000μm.
High Compatibility
High Compatibility
Compatible with 8-inch and 12-inch patterned wafers, compatible with 2D defect detection and 3D metrology.

Product Features

High Production Capacity
High Production Capacity
Productivities ≥ 60WPH (@6-inch wafer, do not calculate the review photographing time).
High Accuracy
High Accuracy
Minimum defect size: 0.5μm; false negative rate: ≤ 0.2%, false positive rate: ≤ 1%, detection repeatability: ≥ 99%.
Software Extension Functions
Software Extension Functions
Support SECS/GEM interface protocol, and support remote operation and maintenance. Support input and output of Map formats such as Sinf, Klarf, etc.
AI Technology Application
AI Technology Application
The self-developed AI vision integration solution effectively improves the defect detection ability and reduces the false positive rate. With AI-based ADC function, defect classification accuracy ≥98%.
Wide Detection Range
Wide Detection Range
Applicable products: SIC/GaN and other compound process products. Detection capabilities: defect positioning and object length, width, diameter, aperture, offset, etc.
High Compatibility
High Compatibility
Compatible with 4-inch, 6-inch and 8-inch patterned wafers, compatible with 2D defect detection and metrology. Compatible with different processes of the costomer, equipped with high, medium and low resolution imaging capabilities, to ensure the yield of the customer's front-end process.

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