Committed to innovation breakthrough and productivity innovation in the field of Integrated Circuit, providing integrated solution, includes wafer metrology and inspection solution, and cutting technology solution.
Wafer metrology and inspection: focuses on the R&D, production and sales of wafer metrology and inspection equipments for the whole process of integrated circuits and provides integrated solutions with AI-vision integration, combining advantages in the fields of high precision motion control,advanced optics,and artificial intelligence.
Process cutting solution: supports a variety of materials including silicon wafers, compound semiconductors, glass, substrates, etc. and provides a variety of solutions for semiconductor packaging process cutting.
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